Principal/Sr Principal Engineer RF Microwave Design
Company: Northrop Grumman
Location: Baltimore
Posted on: September 29, 2024
Job Description:
Requisition ID: R
- Category: Engineering
- Location: Baltimore, Maryland, United States of America
- Clearance Type: Top Secret
- Telecommute: No- Teleworking not available for this
position
- Shift: 1st Shift (United States of America)
- Travel Required: Yes, 10% of the Time
- Relocation Assistance: Relocation assistance may be
available
- Positions Available: 1At Northrop Grumman, our employees have
incredible opportunities to work on revolutionary systems that
impact people's lives around the world today, and for generations
to come. Our pioneering and inventive spirit has enabled us to be
at the forefront of many technological advancements in our nation's
history - from the first flight across the Atlantic Ocean, to
stealth bombers, to landing on the moon. We look for people who
have bold new ideas, courage and a pioneering spirit to join forces
to invent the future, and have fun along the way. Our culture
thrives on intellectual curiosity, cognitive diversity and bringing
your whole self to work - and we have an insatiable drive to do
what others think is impossible. Our employees are not only part of
history, they're making history. Northrop Grumman Space Systems
sector delivers a decisive advantage to its customers through
software-defined, hardware-enabled solutions. The Electrical Design
and Analysis (EDA) section in Baltimore, MD enables these hardware
solutions by providing RF microwave architecture, design,
verification, and support expertise across a wide variety of
electronic sensor products. Our engineers work on complex, leading
edge, high reliability electronics supporting different space
platforms. NGSS engineers share a great sense of pride knowing
their contributions have a direct effect on the safety and security
of the country and its allies. Our culture thrives on intellectual
curiosity, cognitive diversity, teamwork, and bringing your whole
self to work to accomplish the mission while learning and having
fun along the way. Our department is fertile ground for all
experience levels to become part of our growing team and contribute
to our goals. The department offers opportunities to grow on a
technical track both broad and deep as well as explore project
leadership or management positions. This role will support our
Payload and Ground Systems Division and Remote Sensing Programs
(RSP) Business Unit. EDA is seeking engineers with experience and
interest in RF/Microwave and Mixed Signal circuit card assembly
(CCA) design and test including:
- Designing, modeling, and verifying RF/microwave and mixed
signal CCAs, particularly Digital Receiver/Exciters
- Utilize analysis, simulations and prototyping to develop CCA
designs
- Managing RF budgets, frequency planning, and common assembly
level interfaces
- Predicting assembly level performance through selecting
materials, components, and packaging approaches, RF chain analysis,
electromagnetic simulation, data collection and analysis, and other
modeling techniquesPrincipal RF/Microwave Design Engineer Basic
Qualifications:
- Bachelor Degree in Electrical Engineering or comparable STEM
degree minimum of 5 years of relevant engineering experience (3+
years with MS degree; or PhD)
- Proficient in RF/Microwave and mixed signal circuit design,
schematic capture, and PWB/board layout
- Completed and/or led multiple board designs from schematic
capture to board release
- Experience in test and troubleshooting complex mixed signal
CCAs
- Ability to provide solutions to a broad variety of RF/Microwave
design and test related problems of complex difficulty
- Exhibit intermediate to expert proficiency with industry
standard RF/Microwave modeling, simulation and printed circuit
board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave,
Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO,
TICRA)
- Be able to work on multi-discipline engineering teams and
communicate clearly within integrated product team leads
- Easily adapt to design challenges to meet program goals and
deadlines
- US Citizenship is required
- Ability to obtain and maintain a TS/SCI clearanceSr. Principal
RF/Microwave Design Engineer Basic Qualifications:
- Bachelor Degree in Electrical Engineering or comparable STEM
degree minimum of 9 years of relevant engineering experience (7+
years with MS degree; or 4+ years with PhD)
- Proficient in RF/Microwave and mixed signal circuit design,
schematic capture, and PWB/board layout
- Completed and/or led multiple board designs from schematic
capture to board release
- Experience in test and troubleshooting complex mixed signal
CCAs
- Ability to provide solutions to a broad variety of RF/Microwave
design and test related problems of complex difficulty
- Expert proficiency with industry standard RF/Microwave
modeling, simulation and printed circuit board design tools (e.g.
ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS,
Xpedition, Altium, FEKO, TICRA)
- Demonstrated Technical Team Leadership and ability to work on
multi-discipline engineering teams and communicate clearly within
integrated product team leads
- Easily adapt to design challenges to meet program goals and
deadlines
- US Citizenship is required
- Ability to obtain and maintain a TS/SCI clearancePreferred
Qualifications:
- Active Top Secret / SCI security clearance
- Experience in Worst Case Circuit Analysis (WCCA) including
logic compatibility, component derating, timing analysis, signal
and power integrity analyses
- Signal integrity analysis (SERDES, Bit error rates, jitter
components and contributors, board to board analysis)
- Expertise in working with receiver/exciters, conducting RF
performance analysis, and implementing digital beamforming
- High-speed digital circuit design experience
- Familiarity with Point of Load (PoL) design
- Experience in integrating FPGA/Digital controls on the bench
(no VHDL experience required)
- Understanding of basic signal processing
- RF budgeting, frequency planning, RF chain analysis and
modeling
- Component selection and/or custom component requirements flow
down and trades
- Ceramic and organic printed circuit board materials, design,
fabrication, and assembly processes
- Integrated Circuit packaging techniques including
chip-and-wire, QFN, flip-chip
- Product life cycle support from concept through production
support
- Designing for high reliability, space requirements and
environments
- AESA / phased array, Radar, SIGINT, or SATCOM experienceSalary
Range: $102,400 - $153,600Salary Range 2: $127,000 - $190,600The
above salary range represents a general guideline; however,
Northrop Grumman considers a number of factors when determining
base salary offers such as the scope and responsibilities of the
position and the candidate's experience, education, skills and
current market conditions.Employees may be eligible for a
discretionary bonus in addition to base pay. Annual bonuses are
designed to reward individual contributions as well as allow
employees to share in company results. Employees in Vice President
or Director positions may be eligible for Long Term Incentives. In
addition, Northrop Grumman provides a variety of benefits including
health insurance coverage, life and disability insurance, savings
plan, Company paid holidays and paid time off (PTO) for vacation
and/or personal business.The application period for the job is
estimated to be 20 days from the job posting date. However, this
timeline may be shortened or extended depending on business needs
and the availability of qualified candidates.Northrop Grumman is
committed to hiring and retaining a diverse workforce. We are proud
to be an Equal Opportunity/Affirmative Action Employer, making
decisions without regard to race, color, religion, creed, sex,
sexual orientation, gender identity, marital status, national
origin, age, veteran status, disability, or any other protected
class. For our complete EEO/AA and Pay Transparency statement,
please visit. U.S. Citizenship is required for all positions with a
government clearance and certain other restricted positions.
Keywords: Northrop Grumman, Baltimore , Principal/Sr Principal Engineer RF Microwave Design, Engineering , Baltimore, Maryland
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